• DocumentCode
    2084619
  • Title

    Breakdown voltage of polypropylene laminated paper (PPLP) in plain samples and a full scale cable

  • Author

    Worzyk, Thomas B. ; Bergkvist, Mikael ; Nordberg, Per ; Tornkvist, Christer

  • Author_Institution
    ABB High Voltage Cables, Karlskrona, Sweden
  • Volume
    1
  • fYear
    1997
  • fDate
    19-22, Oct 1997
  • Firstpage
    329
  • Abstract
    Polypropylene laminated paper (PPLP) has been used as ac power cable insulation for a number of years. However, reports on the use of PPLP in high voltage direct current (HVDC) cables are sparse. In this paper we report dc breakdown strength of impregnated PPLP samples. Experimental breakdown data from identically treated samples both from Kraft paper and PPLP have been analyzed assuming a Weibull distribution. The results suggest that PPLP insulation is superior to paper insulation on a lab scale but more sensitive to volume effects than paper insulation. A full scale mass-impregnated PPLP cable has been type-tested successfully according to CIGRE recommendations. Additional impulse tests on the cable suggest a higher Lightning Impulse Withstand Level (LIWL) compared with a similar mass-impregnated paper cable. The performance ratio of PPLP vs. paper is substantially higher for dc breakdown tests on plain lab samples than for impulse breakdown test on full scale cables
  • Keywords
    HVDC power transmission; Weibull distribution; composite insulating materials; electric strength; laminates; organic insulating materials; paper; polymer films; power cable insulation; DC breakdown strength; HVDC cable; Kraft paper; Lightning Impulse Withstand Level; Weibull distribution; impulse breakdown; mass-impregnated PPLP; plain sample; polypropylene laminated paper; power cable insulation; Cable insulation; Electric breakdown; HVDC transmission; Impulse testing; Oil filled cables; Power cable insulation; Power cables; Stress; Voltage; Weibull distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 1997. IEEE 1997 Annual Report., Conference on
  • Conference_Location
    Minneapolis, MN
  • Print_ISBN
    0-7803-3851-0
  • Type

    conf

  • DOI
    10.1109/CEIDP.1997.634625
  • Filename
    634625