DocumentCode :
2085055
Title :
Multi-layered poly-dimethylsiloxane as a non-hermetic packaging material for medical MEMS
Author :
Lachhman, S. ; Zorman, C.A. ; Ko, Wen H.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Case Western Reserve Univ., Cleveland, OH, USA
fYear :
2012
fDate :
Aug. 28 2012-Sept. 1 2012
Firstpage :
1655
Lastpage :
1658
Abstract :
Poly-dimethylsiloxane (PDMS) is an attractive material for packaging implantable biomedical microdevices owing to its biocompatibility, ease in application, and bio-friendly mechanical properties. Unfortunately, devices encapsulated solely by PDMS lack the longevity for use in chronic implant applications due to defect-related moisture penetration through the packaging layer caused by conventional deposition processes such as spin coating. This paper describes an effort to improve the performance of PDMS as a packaging material by constructing the encapsulant from multiple, thin roller casted layers of PDMS as a part of a polymeric multi-material package.
Keywords :
bioMEMS; packaging; polymers; spin coating; biocompatibility; biomedical microdevice; chronic implant applications; defect related moisture penetration; medical MEMS; multilayered polydimethylsiloxane; nonhermetic packaging material; spin coating; Casting; Coatings; Implants; Packaging; Polymers; Surface treatment; Dimethylpolysiloxanes; Electricity; Electronics, Medical; Humans; Micro-Electrical-Mechanical Systems; Product Packaging; Surface Properties; Telemetry; Time Factors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE
Conference_Location :
San Diego, CA
ISSN :
1557-170X
Print_ISBN :
978-1-4244-4119-8
Electronic_ISBN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2012.6346264
Filename :
6346264
Link To Document :
بازگشت