Solving heat conduction problems in Mathematica environment

Author

Mykhalchuk, Myroslav ; Fedasyuk, Dmytro

Author_Institution

CAD Dept., Nat. Univ. Lvivska Polytechnica, Lviv, Ukraine

fYear

2001

fDate

12-17 Feb. 2001

Firstpage

164

Lastpage

165

Abstract

The aim of this paper is to demonstrate benefits of applying innovative symbolic computation tools to solving heat conduction problems that often arise in engineering practice. Wolfram Research´s Mathematica 4.0 application was used, For demonstration purposes a transient nonlinear problem in a 2D square area. was chosen, as a frequently encountered one in thermal design of microelectronics, although the approach is readily extensible to a wide range of problems. The paper further extends the insights and developments.

Keywords

digital simulation; heat conduction; symbol manipulation; thermal management (packaging); transient analysis; 2D square area; Mathematica environment; engineering practice; heat conduction problems; microelectronics; symbolic computation tools; thermal design; transient nonlinear problem; Boundary conditions; Differential equations; Displays; Eigenvalues and eigenfunctions; Packaging; Partial differential equations; Physics computing; Symmetric matrices; Temperature distribution; Transforms;

fLanguage

English

Publisher

ieee

Conference_Titel

CAD Systems in Microelectronics, 2001. CADSM 2001. Proceedings of the 6th International Conference. The Experience of Designing and Application of

Conference_Location

Lviv-Slavsko, Ukraine

Print_ISBN

966-553-079-8

Type

conf

DOI

10.1109/CADSM.2001.975794

Filename

975794