Numerical and experimental modeling of high-speed cables and interconnects

Author

Beker, Benjamin ; Hirsch, Tom

Author_Institution

Dept. of Electr. & Comput. Eng., South Carolina Univ., Columbia, SC, USA

fYear

1997

fDate

18-21 May 1997

Firstpage

898

Lastpage

904

Abstract

This paper presents the results of a numerical and experimental study of high-speed cable/high-density connector assemblies. Realistic cable models and lumped element parameters of practical connector geometries were used in the numerical simulations. A quasi-static approach was taken to calculate the capacitance matrices of multi-pin connectors and a novel, efficient scheme was employed to de-embed the inductance matrix. The SPICE equivalent circuit of the connector was incorporated into the cable model to study the effects of crosstalk. Numerical simulations were validated by measured data. Experimental results and SPICE simulations agree well, typically to within 12%

Keywords

SPICE; cables (electric); capacitance; crosstalk; electric connectors; equivalent circuits; inductance; SPICE equivalent circuit; cable models; capacitance matrices; connector geometries; crosstalk; high-density connector; high-speed cables; inductance matrix; lumped element parameters; multi-pin connectors; numerical simulations; quasi-static approach; Assembly; Cables; Capacitance; Connectors; Geometry; Inductance; Numerical models; Numerical simulation; SPICE; Solid modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1997. Proceedings., 47th

Conference_Location

San Jose, CA

ISSN

0569-5503

Print_ISBN

0-7803-3857-X

Type

conf

DOI

10.1109/ECTC.1997.606276

Filename

606276