Title :
Numerical and experimental modeling of high-speed cables and interconnects
Author :
Beker, Benjamin ; Hirsch, Tom
Author_Institution :
Dept. of Electr. & Comput. Eng., South Carolina Univ., Columbia, SC, USA
Abstract :
This paper presents the results of a numerical and experimental study of high-speed cable/high-density connector assemblies. Realistic cable models and lumped element parameters of practical connector geometries were used in the numerical simulations. A quasi-static approach was taken to calculate the capacitance matrices of multi-pin connectors and a novel, efficient scheme was employed to de-embed the inductance matrix. The SPICE equivalent circuit of the connector was incorporated into the cable model to study the effects of crosstalk. Numerical simulations were validated by measured data. Experimental results and SPICE simulations agree well, typically to within 12%
Keywords :
SPICE; cables (electric); capacitance; crosstalk; electric connectors; equivalent circuits; inductance; SPICE equivalent circuit; cable models; capacitance matrices; connector geometries; crosstalk; high-density connector; high-speed cables; inductance matrix; lumped element parameters; multi-pin connectors; numerical simulations; quasi-static approach; Assembly; Cables; Capacitance; Connectors; Geometry; Inductance; Numerical models; Numerical simulation; SPICE; Solid modeling;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606276
