• DocumentCode
    2086481
  • Title

    On the k-layer planar subset and via minimization problems

  • Author

    Cong, Jason ; Liu, C.L.

  • Author_Institution
    Dept. of Comput. Sci., Illinois Univ., IL, USA
  • fYear
    1990
  • fDate
    12-15 Mar 1990
  • Firstpage
    459
  • Lastpage
    463
  • Abstract
    An important problem in performance-driven routing is the k -layer planar subset problem which is to choose a maximum (weighted) subset of nets such that each net in the subset can be routed in one of k `preferred´ layers. Related to the k-layer planar subset problem is the k-layer topological via-minimization problem which is to determine the topology of each net using k routing layers such that a minimum number of vias is used. For the case k=2, the topological via minimization problem has been studied by CAD researchers for a long time because of its practical and theoretical importance. The authors show that both the general k-layer planar subset problem and the k-layer topological via minimisation problem are NP-complete. Moreover, they show that both problems can be solved in polynomial time for a large class of channels, called crossing channels. It can be shown that under a realistic assumption, all the channels for inter-block connections in the general cell design style are crossing channels. The authors algorithms are based on an efficient algorithm for computing a maximum weighted·k-cofamily in a partially ordered set
  • Keywords
    VLSI; circuit layout CAD; computational complexity; minimisation; CAD; NP-complete; VLSI; crossing channels; k-layer planar subset; maximum weighted·k-cofamily; partially ordered set; routing layers; via minimization problems; Circuit optimization; Clocks; Computer science; Contracts; Fabrication; Minimization; Polynomials; Routing; Topology; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 1990., EDAC. Proceedings of the European
  • Conference_Location
    Glasgow
  • Print_ISBN
    0-8186-2024-2
  • Type

    conf

  • DOI
    10.1109/EDAC.1990.136691
  • Filename
    136691