Title :
Volume shrinkage induced by interfacial reactions in micro joints
Author :
Li, C.C. ; Zhu, Z.X. ; Chen, M.H. ; Kao, C.R.
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Taiwan Univ., Taipei, Taiwan
fDate :
Feb. 27 2013-March 1 2013
Abstract :
In 3D-IC, solder joints of a few microns in size are used. Theoretically, there is 11.4% shrinkage in volume when Ni reacted with Sn to form Ni3Sn4. Surface profilometer and SEM analysis were carried out to measure the actual volume shrinkage for micro Ni/Sn/Ni sandwich structures during an isothermal annealing at 180°C for 0-7 days. The results showed there was about 7.3% shrinkage in volume and the remaining 3.2% shrinkage was released by forming voids. The internal stress and the forming of voids caused by solid state reaction might induce potential reliability issues.
Keywords :
annealing; integrated circuit packaging; internal stresses; nickel; scanning electron microscopy; shrinkage; solders; three-dimensional integrated circuits; tin; voids (solid); 3D IC; Ni-Sn-Ni; SEM analysis; interfacial reaction; internal stress; isothermal annealing; micro joints; sandwich structures; solder joints; solid state reaction; surface profilometer; temperature 180 C; time 0 day to 7 day; voids; volume shrinkage; Abstracts; Joints; Nickel; Roads; Strain; Three-dimensional displays; Tin;
Conference_Titel :
Advanced Packaging Materials (APM), 2013 IEEE International Symposium on
Conference_Location :
Irvine, CA
Print_ISBN :
978-1-4673-6093-7
Electronic_ISBN :
1550-5723
DOI :
10.1109/ISAPM.2013.6510383
