Packaging materials for 2.5/3D technology

Author

Schmaltz, B.

Author_Institution

NAMICS Technol., San Jose, CA, USA

fYear

2013

fDate

Feb. 27 2013-March 1 2013

Firstpage

93

Lastpage

101

Abstract

The age of advanced mobile devices is on the direct horizon, are we ready for it? Less power consumption, faster processing, high reliability, high yield, low cost are words engineers are all too familiar with. 2.5/3D utilizing interposer technology, Thru Silicon Via (TSV), sub-50μm die thickness are a few of the latest techniques engineers use to solve these issues. As technology progresses to smaller process generations, new packaging applications are being demanded. The standard solder reflow process is being pushed by advancements in Cu pillar bumps, thermal compression bonding (TCB) and wafer level/pre-applied materials. This presentation will centralize around the latest advancements in NAMICS Materials for Advanced Packaging Technology; Capillary Underfill (CUF), Pre-Applied Material, Non-Conductive Paste (NCP), Non-Conductive Films (NCF).

Keywords

integrated circuit packaging; reflow soldering; three-dimensional integrated circuits; 2.5-3D technology; CUF; NAMICS materials; NCF; NCP; TCB; TSV; advanced mobile devices; advanced packaging technology; capillary underfill; die thickness; interposer technology; nonconductive films; nonconductive paste; packaging applications; packaging materials; pillar bumps; power consumption; size 50 mum; standard solder reflow process; thermal compression bonding; thru silicon via; wafer level-pre-applied materials; Abstracts; Bonding; Lead; Market research; Materials; Three-dimensional displays; Vacuum technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials (APM), 2013 IEEE International Symposium on

Conference_Location

Irvine, CA

ISSN

1550-5723

Print_ISBN

978-1-4673-6093-7

Electronic_ISBN

1550-5723

Type

conf

DOI

10.1109/ISAPM.2013.6510392

Filename

6510392