Title :
Packaging materials for 2.5/3D technology
Author_Institution :
NAMICS Technol., San Jose, CA, USA
fDate :
Feb. 27 2013-March 1 2013
Abstract :
The age of advanced mobile devices is on the direct horizon, are we ready for it? Less power consumption, faster processing, high reliability, high yield, low cost are words engineers are all too familiar with. 2.5/3D utilizing interposer technology, Thru Silicon Via (TSV), sub-50μm die thickness are a few of the latest techniques engineers use to solve these issues. As technology progresses to smaller process generations, new packaging applications are being demanded. The standard solder reflow process is being pushed by advancements in Cu pillar bumps, thermal compression bonding (TCB) and wafer level/pre-applied materials. This presentation will centralize around the latest advancements in NAMICS Materials for Advanced Packaging Technology; Capillary Underfill (CUF), Pre-Applied Material, Non-Conductive Paste (NCP), Non-Conductive Films (NCF).
Keywords :
integrated circuit packaging; reflow soldering; three-dimensional integrated circuits; 2.5-3D technology; CUF; NAMICS materials; NCF; NCP; TCB; TSV; advanced mobile devices; advanced packaging technology; capillary underfill; die thickness; interposer technology; nonconductive films; nonconductive paste; packaging applications; packaging materials; pillar bumps; power consumption; size 50 mum; standard solder reflow process; thermal compression bonding; thru silicon via; wafer level-pre-applied materials; Abstracts; Bonding; Lead; Market research; Materials; Three-dimensional displays; Vacuum technology;
Conference_Titel :
Advanced Packaging Materials (APM), 2013 IEEE International Symposium on
Conference_Location :
Irvine, CA
Print_ISBN :
978-1-4673-6093-7
Electronic_ISBN :
1550-5723
DOI :
10.1109/ISAPM.2013.6510392
