MEMS in laminates and package substrates

Post semiconductor manufacturing processes (PSM), including packaging and printed circuit board (PCB) technologies with a few micrometer line and space resolution and sub-mil vias are readily achievable. Such PSM technology can be used to manufacture micro electromechanical systems (MEMS) for sensing and actuation applications, which are traditionally produced using silicon processes. A lamination-based manufacturing process allows for a broader selection of materials and fabrication processes than silicon-based manufacturing, and therefore provides greater design freedom for producing functional microdevices. In many cases devices can be fabricated that are more suited to their applications than their silicon counterparts. Furthermore, such microdevices can be built with a high degree of integration, pre-packaged, and at low cost. Indeed, the PCB and packaging industries stand to benefit greatly by expanding their offerings beyond serving the semiconductor industry and developing their own devices and products. This paper illustrates that good quality MEMS devices can be manufactured in laminates, and discusses some of the unique benefits of such devices. This laminate MEMS technology promises for not only manufacturing microdevices but also heterogeneously integrating them with silicon microelectronics into their package with the same manufacturing processes.