Electromagnetic Characterisation and Modeling of Stripline Structures with Slotted and Meshed Ground Planes

Analyses of the effects of a holed ground plane on the signal line impedance are presented. Such patterns are very useful in advanced multichip packages since they allow high density interconnection networks. Variations in line impedance, propagation constants and cross-talk noises as a fuction of hole sizes and line positions are given. A good agreement between theoretical models and experimental results achieved both in time and frequency domains is obtained. Simulated signals are then given and sucessfully compared to experimental curves.