Title :
Low melting alloy TIMS - second look for demanding applications?
Author_Institution :
Bergquist, USA
fDate :
Feb. 27 2013-March 1 2013
Abstract :
Abstract not available. The document was not made available for publication as part of the conference proceedings.
Conference_Titel :
Advanced Packaging Materials (APM), 2013 IEEE International Symposium on
Conference_Location :
Irvine, CA, USA
Print_ISBN :
978-1-4673-6093-7
Electronic_ISBN :
1550-5723
DOI :
10.1109/ISAPM.2013.6510416
