• DocumentCode
    2087887
  • Title

    Building true logic LNVM with automotive-level reliability

  • Author

    Horch, Andrew ; Wang, Bin ; Niset, Martin ; Hu, TJ ; Gilliland, Troy ; Humes, Todd

  • Author_Institution
    Embedded NVM Group, Virage Logic Inc., Seattle, WA, USA
  • fYear
    2008
  • fDate
    11-14 Nov. 2008
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Logic NVM (LNVM) developed in baseline logic processes is gaining more interest from automotive applications. We discuss for the first time how to build such LNVM to achieve and assure automotive-level quality through the product development cycle. We successfully demonstrate that in-field reliability < 1 ppm may be achieved with appropriate layout and architecture selections.
  • Keywords
    automobile industry; digital storage; logic; product life cycle management; reliability; LNVM; automotive-level reliability; baseline logic processes; in-field reliability; logic nonvolatile memory solutions; product development cycle; Automotive applications; Automotive engineering; Costs; Design for manufacture; Logic; Nonvolatile memory; Phase change materials; Product development; Production; Testing; Logic NVM; automotive; floating-gate; qualification; reliability modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Non-Volatile Memory Technology Symposium, 2008. NVMTS 2008. 9th Annual
  • Conference_Location
    Pacific Grove, CA
  • Print_ISBN
    978-1-4244-3659-0
  • Electronic_ISBN
    978-1-4244-2411-5
  • Type

    conf

  • DOI
    10.1109/NVMT.2008.4731197
  • Filename
    4731197