DocumentCode :
2088024
Title :
Effects of gate recess depth on very high performance 0.1 mm GaAs MESFET´s
Author :
Moore, Karen E. ; East, Jack R. ; Haddad, George I. ; Brock, Tim
Author_Institution :
Center for High Frequency Microelectronics, Solid State Electronics Laboratory, The University of Michigan, Ann Arbor, MI 48109-2122. Tel: (313) 763-6132 or (313) 747-1781 (Fax)
fYear :
1993
fDate :
6-10 Sept. 1993
Firstpage :
99
Lastpage :
101
Abstract :
0.1 ¿m gate length conventional GaAs MESFET´s have been fabricated with a wide range of saturation currents. These devices show excellent DC and RF performance, with very little variation of device behavior with recess depth. The overall performance of these devices is competitive with the best MESFET´s demonstrated to date, with average transconductances of 578 mS/mm and average ft´s of 97 GHz. The invariance of device performance with gate recess depth demonstrates a strong advantage for GaAs MESFET´s in terms of both process latitude and device design.
Keywords :
Etching; Extrapolation; Gallium arsenide; Gold; Lifting equipment; MESFETs; Microelectronics; Radio frequency; Solid state circuits; Transconductance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 1993. 23rd European
Conference_Location :
Madrid, Spain
Type :
conf
DOI :
10.1109/EUMA.1993.336800
Filename :
4136538
Link To Document :
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