DocumentCode :
2088394
Title :
Electronic packaging education: a view from 1992 and 1996 conferences
Author :
Krusius, J.P. ; Li, Che-Yu ; Fillo, J.
Author_Institution :
Cornell Univ., Ithaca, NY, USA
fYear :
1997
fDate :
18-21 May 1997
Firstpage :
964
Lastpage :
966
Abstract :
A summary of two national electronic packaging education conferences, (one held in 1992 and the other in 1996) is given. Both had about 50 attendees from universities, industry, and government organizations. The discussion results, recommendations, and action items are highlighted
Keywords :
electronic engineering education; packaging; action items; conferences; electronic packaging education; recommendations; Books; Continuing education; Educational programs; Electrical engineering; Electronics industry; Electronics packaging; Government; Manufacturing industries; Materials science and technology; Mechanical engineering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
ISSN :
0569-5503
Print_ISBN :
0-7803-3857-X
Type :
conf
DOI :
10.1109/ECTC.1997.606286
Filename :
606286
Link To Document :
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