Title :
A breakthrough in optimizing throughput and manufacturing efficiency via factory-wide dynamic WIP dispatching in 300mm semiconductor manufacturing
Author :
Li, Bo ; Wu, Johnny ; Herring, Michael P. ; Mouli, Chandra
Author_Institution :
Intel Corp., Hillsboro, OR
Abstract :
With the rapidly advancing semiconductor technology and competitive business conditions, it is very crucial to maintain high operation efficiency and maximize the key product throughput to supply market in a timely manner. Dynamic WIP (work in process) dispatching is a new technology to efficiently dispatch semiconductor manufacturing materials to desired tools for lot process promptly in response to dynamically changing operational and business needs. This paper describes how dynamic WIP dispatching capabilities are built on the next generation Manufacturing Execution System in Intel´s manufacturing facilities, and employed in advanced 300 mm factories to significantly reduce throughput times, inventory levels, and labor overhead
Keywords :
dispatching; integrated circuit manufacture; inventory management; production engineering computing; production facilities; work in progress; 300 mm; Intels manufacturing facilities; Manufacturing Execution System; competitive business conditions; factory-wide dynamic WIP dispatching; inventory levels; labor overhead; lot process; manufacturing efficiency optimization; operation efficiency; product throughput; semiconductor manufacturing; semiconductor manufacturing materials; semiconductor technology; supply market; throughput optimization; throughput time reduction; work in process; Aerodynamics; Dispatching; Manufacturing automation; Manufacturing processes; Production facilities; Pulp manufacturing; Semiconductor device manufacture; Semiconductor materials; Throughput; Vehicle dynamics;
Conference_Titel :
Semiconductor Manufacturing, 2005. ISSM 2005, IEEE International Symposium on
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-9143-8
DOI :
10.1109/ISSM.2005.1513291
