DocumentCode
2089599
Title
Significant improvement of LPCVD nitride furnace availability by dedicating "thick" and "thin" processes
Author
Fugardi, Stephen G. ; Higgins, Paul J. ; Hansen, Mark A. ; Chan, John K.
Author_Institution
IBM East Fishkill, Hopewell Junction, NY
fYear
2005
fDate
13-15 Sept. 2005
Firstpage
113
Lastpage
114
Abstract
At IBM East Fishkill´s 300 mm multi-part ASCIX fab, the LPCVD nitride furnace sector failed to meet its manufacturing availability target after its full production ramp early in 2005. The 8% SPC failure rate in foreign material (FM) was the top downtime detractor resulting in an overall sector availability 20% below plan. Installing new furnaces was not an option, so fundamental changes in the sector operation were required
Keywords
chemical vapour deposition; furnaces; integrated circuit manufacture; statistical process control; 300 mm; IBM East Fishkill; LPCVD nitride furnace; SPC failure rate; foreign material; manufacturing availability target; thick processes; thin processes; Availability; Boats; Condition monitoring; Contamination; Furnaces; Manufacturing processes; Parallel robots; Production; Productivity; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2005. ISSM 2005, IEEE International Symposium on
Conference_Location
San Jose, CA
Print_ISBN
0-7803-9143-8
Type
conf
DOI
10.1109/ISSM.2005.1513310
Filename
1513310
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