• DocumentCode
    2089796
  • Title

    Development of equipment-installed APC system and critical dimension control technology of gate-hard-mask etching using its system

  • Author

    Imai, Shin-ichi ; Sano, Asaki ; Fujimoto, Manabu

  • Author_Institution
    Manuf. Technol. Center, Matsushita Electr. Ind. Co. Ltd., Toyama, Japan
  • fYear
    2005
  • fDate
    13-15 Sept. 2005
  • Firstpage
    139
  • Lastpage
    142
  • Abstract
    In the current device manufacturing, APC technology becomes important to reduce the deviation of process capability. A conventional APC system is generally installed to MES. In the case of introducing APC to a factory, development of interface and heavy connection-costs between MES and APC are necessary. In order to solve these problems, an equipment-installed APC system was developed and its performance was confirmed by measuring query time. Moreover, in executing APC, an APC recipe group is necessary and by using DOE and RSM, an APC recipe group could be effectively developed. These technologies of the APC system and the APC recipe group were applied to CD control of gate-hard-mask etching and CD deviation could be reduced.
  • Keywords
    design of experiments; etching; integrated circuit manufacture; manufacturing systems; masks; process capability analysis; process control; response surface methodology; spatial variables control; DOE; RSM; advanced process control; advanced process control recipe group; critical dimension control technology; design of experiment; equipment-installed APC system; factories; gate-hard-mask etching; manufacturing execution system; process capability; response surface method; semiconductor device manufacturing; Control systems; Dry etching; Insulation; Lithography; Manufacturing processes; Process control; Response surface methodology; Semiconductor device manufacture; Toy manufacturing industry; US Department of Energy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2005. ISSM 2005, IEEE International Symposium on
  • Print_ISBN
    0-7803-9143-8
  • Type

    conf

  • DOI
    10.1109/ISSM.2005.1513318
  • Filename
    1513318