Title :
Virtual metrology: a solution for wafer to wafer advanced process control
Author :
Chen, PingHsu ; Wu, Sunny ; Lin, Junshien ; Ko, Francis ; Lo, Henry ; Wang, Jean ; Yu, C.H. ; Liang, M.S.
Author_Institution :
Taiwan Semicond. Manuf. Co. Ltd., Hsin-Chu, Taiwan
Abstract :
Virtual metrology (VM) is a novel technology to predict wafer performance from tool slate variables. Virtual metrology can enable wafer to wafer control without additional real metrology.
Keywords :
integrated circuit manufacture; integrated circuit measurement; process control; size control; advanced process control; tool slate variables; virtual metrology; wafer performance; wafer-to-wafer process control; Databases; Frequency; Metrology; Plasma applications; Plasma chemistry; Plasma density; Plasma temperature; Process control; Production; Virtual manufacturing;
Conference_Titel :
Semiconductor Manufacturing, 2005. ISSM 2005, IEEE International Symposium on
Print_ISBN :
0-7803-9143-8
DOI :
10.1109/ISSM.2005.1513322
