Title :
Simple implementation of a first order advanced process control engine for thin film applications
Author :
Smith, Eugene ; Raviswaran, Arvind
Author_Institution :
Cypress Semicond. Minnesota Inc., Bloomington, MN, USA
Abstract :
PECVD of dielectric films show two major variation sources (lot-to-lot variation and device-to-device variation) that reduce the process Cpk and increase the cost of operation. To improve the PECVD process manufacturability, some form of automated compensation at runtime is necessary. This paper presents a first order APC engine that compensates for process tool deposition rate drift and pattern density differences. Both are needed to allow for a single recipe to deliver ´on target´ performance for many devices and process tools. This project improved Cpk from ∼1.0 to over 2.0.
Keywords :
dielectric thin films; integrated circuit manufacture; plasma CVD; process control; PECVD; advanced process control engine; deposition rate drift; device-to-device variation; dielectric films; first order advanced process control; lot-to-lot variation; manufacturability; plasma enhanced chemical vapor deposition; process tool; thin film applications; Application software; Dielectric films; Dielectric thin films; Engines; Inductors; Manufacturing processes; Process control; Semiconductor device manufacture; Semiconductor thin films; Transistors;
Conference_Titel :
Semiconductor Manufacturing, 2005. ISSM 2005, IEEE International Symposium on
Print_ISBN :
0-7803-9143-8
DOI :
10.1109/ISSM.2005.1513324
