Damage-free wafer cleaning by water and gas mixture jet

Author

Hirota, Yusaku ; Kanno, Itaru ; Fujiwara, Keiji ; Nagayasu, Hiroshi ; Shimose, Shouichi

Author_Institution

Renesas Technol. Corp., Tokyo Electron Ltd., Hyogo, Japan

fYear

2005

fDate

13-15 Sept. 2005

Firstpage

219

Lastpage

222

Abstract

A damage-free single wafer cleaning method using a water and gas mixture jet (two-fluid jet) has been developed. It was confirmed that the combination cleaning process of the two-fluid jet and APM (NH₄OH/H₂O₂/DIW) dispense showed higher cleaning performance than that of conventional batch-type APM cleaning for 65 nm gate patterns. The cleaning performance of the two-fluid jet was improved by adjusting the velocity distribution of water droplets. Two-fluid jet cleaning can also be applied to Cu interconnects processes.

Keywords

copper; drops; integrated circuit interconnections; integrated circuit layout; integrated circuit manufacture; jets; large scale integration; surface cleaning; two-phase flow; APM; Cu; Cu interconnects process; damage-free single wafer cleaning method; gate patterns; two-fluid jet; velocity distribution; water droplets; water-gas mixture jet; Chemical processes; Costs; Electrons; Etching; Fluid flow; Large scale integration; Manufacturing processes; Surface cleaning; Temperature; Velocity control;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing, 2005. ISSM 2005, IEEE International Symposium on

Print_ISBN

0-7803-9143-8

Type

conf

DOI

10.1109/ISSM.2005.1513340

Filename

1513340