A novel void detection technique for via filling process

We have developed a new technique for detecting small voids formed at via holes that are rarely detected in the conventional test process. In the developed technique, high current force is used to correctly detect voids within 1 sec. This technique is based on the negative voltage shift caused by void disappearance under a high constant current force. Since void detection is successfully achieved by a quick test without cross-sectional observation, the technique has significant positive impact on screening and process monitoring of production lines. This helps to prevent the shipping of flawed products that would cause problems in the marketplace.