DocumentCode :
2091210
Title :
Getting ready for the simulation revolution in 300mm fab productivity!
Author :
Collins, Donald W. ; Williams, Ken ; Dye, Bob
Author_Institution :
ACADZ Inc., Tempe, AZ
fYear :
2005
fDate :
13-15 Sept. 2005
Firstpage :
348
Lastpage :
351
Abstract :
John Schmitz, COO, SEMATECH 2005 stated "The new economy for microelectronics - with multibillion-dollar FABs and budget-busting technologies will force IC manufacturers to seek unprecedented levels of productivity over the next five years." John is right on target. We should raise the standard for seeking the best alternatives to improving our company\´s bottom line. With $1.2 billion plus 300 mm FABs, discrete event simulation modeling, should become the standard and will certainly be one of the most cost effective alternatives for improving productivity and growth in the future. This paper describes a Generic 300 mm FAB model containing 100 tool sets with 30 parallel tools in each set. This model can easily be edited to match any FAB by adding or subtracting tool sets with a copy and paste function or highlight and delete function similar to MS Word. Once you have the number of tool sets then you can edit each set with the same two functions to add or delete tools within a set to match the number of parallel tools in your FAB. By using a Generic 300 mm FAB model, you can begin simulation within 1-man week
Keywords :
discrete event simulation; industrial economics; integrated circuit manufacture; production engineering computing; productivity; Generic 300 mm FAB model; IC manufacturers; MS Word; SEMATECH 2005; copy function; delete function; discrete event simulation modeling; highlight function; microelectronics; paste function; productivity level; tool sets; Assembly; Databases; Discrete event simulation; Job shop scheduling; Manufacturing; Microelectronics; Predictive models; Production; Productivity; Throughput;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 2005. ISSM 2005, IEEE International Symposium on
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-9143-8
Type :
conf
DOI :
10.1109/ISSM.2005.1513374
Filename :
1513374
Link To Document :
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