New packaging system and materials for FPAC

Author

Hotta, Yuji ; Mochizuki, Amane ; Sakamoto, Michie ; Yoshioka, Masahiro ; Prabhu, Akshata ; Akizuki, Shinya

Author_Institution

Core Technol. Center, Osaka, Japan

fYear

1997

fDate

18-21 May 1997

Firstpage

1029

Lastpage

1031

Abstract

The characteristics demanded of the packages are being diversified; from the anti-popcorn package that was always the main problem in the past 10 years to improving on the package size towards a smaller and thinner size, for example CSP (Chip size package), other concerns being productivity, thermal management and environmental measures. We propose FPAC (Foil covered PACkage) as a packaging technology which can satisfy such requirements. We are also developing the production process and the material which makes this package. FPAC technology can be used to make the package of the thin type, with the high heat dissipation, and high humidity reliability. The process itself is easy with less amount of trash. We report on the current state about this development in this paper

Keywords

foils; packaging; FPAC technology; anti-popcorn package; chip size package; environmental factors; foil covered package; heat dissipation; humidity reliability; productivity; thermal management; Absorption; Humidity; Microassembly; Moisture; Packaging; Production systems; Surface cleaning; Temperature; Thermal management; Transfer molding;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1997. Proceedings., 47th

Conference_Location

San Jose, CA

ISSN

0569-5503

Print_ISBN

0-7803-3857-X

Type

conf

DOI

10.1109/ECTC.1997.606297

Filename

606297