Title :
Effects of polymer die attach-leadframe interface integrity on thermal performance of power semiconductor packages
Author :
Chuang, Shih-Fang ; Kee, David R.
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
Abstract :
In this paper, we investigate the effects of integrity at die-attach/leadframe interface on the thermal resistances of packages. Factors that impact the interface integrity such as leadframe surface finishes, die attach types and thermomechanical stress are addressed. Our goal is to achieve the best thermal performance of power semiconductor packages with optimal conditions
Keywords :
microassembling; polymers; power semiconductor devices; semiconductor device packaging; thermal resistance; polymer die attach-leadframe interface integrity; power semiconductor package; surface finish; thermal performance; thermal resistance; thermomechanical stress; Adhesives; Conducting materials; Copper; Lead; Microassembly; Polymers; Semiconductor device packaging; Semiconductor materials; Thermal conductivity; Thermomechanical processes;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606301
