Integration of the fabrication processes and wafer level packaging of MEMS devices using localized induction heating

Author

Yang, HsuehAn ; Wu, Mingching ; Fang, Weileun

Author_Institution

Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan

fYear

2003

fDate

18-21 Aug. 2003

Firstpage

22

Lastpage

23

Abstract

This paper reports a new method for the integration of fabrication processes and wafer level packaging of optical MEMS device. The electroplated magnetic thick film was employed to realize the localized heating assisted wafer level package. Due to the solder reflow and electroplating technique, hermetic seal of the packaged device is achieved. In addition, the electroplated thick film also performed as a spacer. In applications, the integration the MUMPs devices with the proposed packaging techniques were demonstrated.

Keywords

electroplated coatings; hermetic seals; induction heating; integrated circuit packaging; integrated optoelectronics; magnetic materials; micro-optics; micromechanical devices; optical fabrication; reflow soldering; thick films; MEMS devices; MUMP devices; electroplating; fabrication processes; hermetic seal; localized induction heating; magnetic thick film; solder reflow; wafer level packaging; Heating; Hermetic seals; Integrated optics; Microelectromechanical devices; Optical device fabrication; Optical devices; Optical films; Packaging; Thick films; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Optical MEMS, 2003 IEEE/LEOS International Conference on

Print_ISBN

0-7803-7830-X

Type

conf

DOI

10.1109/OMEMS.2003.1233448

Filename

1233448