DocumentCode :
2093295
Title :
An overview of computer packaging architecture and electrical design
Author :
Chang, Chi
Author_Institution :
IBM, Endicott, NY, USA
fYear :
1990
fDate :
32988
Firstpage :
239
Lastpage :
257
Abstract :
A discussion of packaging architecture is presented to understand the requirement on the physical design of the single chip module (SCM), multichip module (MCM), printed circuit board (PCB), connector, and cable. They in turn establish the driving force for their electrical designs. The packaging architecture of midrange, mainframe, and workstation computer systems provides an insight into the requirements of the physical and electrical design of electronic packaging of the future. It is important to ensure the electrical signal fidelity throughout the interconnection to limit the switching noise and signal crosstalk, and to minimize the propagation delay due to packaging. Electrical design with these consideration for chip carrier, printed circuit boards, connector, and cables is described
Keywords :
cables (electric); digital computers; electric connectors; integrated circuit technology; modules; packaging; printed circuit accessories; printed circuit design; PCB; cable; chip carrier; computer electrical design; computer packaging architecture; connector; electrical signal fidelity; electronic packaging; mainframe; multichip module; printed circuit board; propagation delay; signal crosstalk; single chip module; switching noise; workstation computer; Circuit noise; Computer architecture; Connectors; Crosstalk; Electronics packaging; Integrated circuit interconnections; Multichip modules; Physics computing; Printed circuits; Workstations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Southern Tier Technical Conference, 1990., Proceedings of the 1990 IEEE
Conference_Location :
Binghamton, NY
Type :
conf
DOI :
10.1109/STIER.1990.324651
Filename :
324651
Link To Document :
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