DocumentCode
2094196
Title
Fabrication of optical MEMS switches having multilevel mirror-drive electrodes
Author
Ishii, H. ; Tanabe, Y. ; Shimamura, T. ; Yamaguchi, J. ; Urano, M. ; Kamei, T. ; Kudou, K. ; Yano, M. ; Uenishi, Y. ; Machida, K.
Author_Institution
NTT Microsystem Integration Labs., NTT Corp., Kanagawa, Japan
fYear
2003
fDate
18-21 Aug. 2003
Firstpage
121
Lastpage
122
Abstract
The aim of this work is to show the effective way for the formation of optical MEMS switches by applying seamless integration technology (SeaiT) as a first step toward LSI integration. The fabrication process of the optical MEMS switches in this work consisted of electrode fabrication, mirror fabrication, and packaging. A 6-inch-diameter bulk-Si and SOI wafers are used for the fabrication of electrodes and mirrors, respectively.
Keywords
electrodes; elemental semiconductors; integrated optics; micromirrors; microswitches; optical fabrication; optical switches; packaging; silicon; silicon-on-insulator; 6 inch; LSI integration; SOI wafer; Si; bulk-Si wafer; electrode fabrication; mirror fabrication; multilevel mirror-drive electrodes; optical MEMS switches; packaging; seamless integration technology; Coatings; Electrodes; Integrated optics; Microswitches; Mirrors; Optical device fabrication; Optical sensors; Packaging; Polyimides; Protection;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical MEMS, 2003 IEEE/LEOS International Conference on
Print_ISBN
0-7803-7830-X
Type
conf
DOI
10.1109/OMEMS.2003.1233496
Filename
1233496
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