• DocumentCode
    2094366
  • Title

    Novel interdigital sensors; analysis, measurement and evaluations

  • Author

    Syaifudin, A. R Mohd ; Yu, P.L. ; Mukhopadhyay, S.C. ; Haji-Sheikh, Michael J. ; Chuang, Cheng-Hsin

  • Author_Institution
    Sch. of Eng. & Adv. Technol., Massey Univ., Palmerston North, New Zealand
  • fYear
    2011
  • fDate
    10-12 May 2011
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    New types of planar interdigital sensors, fabricated using three different methods, to assess different chemicals related to food poisoning are reported in the paper. The sensors were designed to have different configurations. The sensors were fabricated using different substrates in order to investigate which of these sensors has better sensing performance. The first design was fabricated on a Printed Circuit Board (PCB) material made from a FR-4 fiberglass; the second sensor design was fabricated using thick film on alumina. The third sensor was designed using thin-film (MEMS) technology and was fabricated on a glass substrate. The sensors were evaluated for different configurations of electrode structure as well as dielectric materials. Experiments have been conducted to analyze the sensors´ performance with three peptide derivatives which are closely related to domoic acid, a natural toxin in seafood and with LPS structure which are related to food pathogens.
  • Keywords
    capacitive sensors; dielectric materials; micromechanical devices; printed circuits; thin film sensors; dielectric material; domoic acid; food pathogen; food poisoning; glass substrate; natural toxin; planar interdigital sensor; printed circuit board material; thin-film MEMS technology; Capacitive sensors; Chemical sensors; Electrodes; Glass; Sensitivity; Sensor phenomena and characterization; Interdigital; LPS; dielectric; peptides; sensing performance; sensitivity measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation and Measurement Technology Conference (I2MTC), 2011 IEEE
  • Conference_Location
    Binjiang
  • ISSN
    1091-5281
  • Print_ISBN
    978-1-4244-7933-7
  • Type

    conf

  • DOI
    10.1109/IMTC.2011.5944033
  • Filename
    5944033