• DocumentCode
    2094946
  • Title

    Comparison of thick-and thin-film technology using wafer probes

  • Author

    Tellex, J Rodriguez

  • Author_Institution
    Department of Electronic & Electrical Engineering, University of Bradford, BRADFORD, West Yorkshire, BD7 1DP, UK. TEL.: +44 274 384008; FAX: +44 274 391521
  • fYear
    1993
  • fDate
    6-10 Sept. 1993
  • Firstpage
    863
  • Lastpage
    865
  • Abstract
    In this paper, a newly-designed thick-film low-cost probe for on-wafer S-parameter measurements is described and compared with a thin-film version. Test results show that the thick-film probe compares well with the thin-film version and that it can be used in measurements at up to 18GHz with little loss in performance. In addition to describing the thick-film probe, this paper describes the materials and fabrication aspects which influence high-frequency thick-film behaviour.
  • Keywords
    Conducting materials; Conductivity; Conductors; Glass; Gold; Probes; Strips; Substrates; Testing; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 1993. 23rd European
  • Conference_Location
    Madrid, Spain
  • Type

    conf

  • DOI
    10.1109/EUMA.1993.336731
  • Filename
    4136792
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2094946