DocumentCode
2094986
Title
IC wire bond inspection using elliptical model approximation
Author
Ngan, King N. ; Kang, Sing B.
Author_Institution
Dept. of Electr. Eng., Nat. Univ. of Singapore, Singapore
fYear
1988
fDate
24-29 Apr 1988
Firstpage
1850
Abstract
An algorithm that has been developed to inspect the integrity of wire bonds on an IC die is described. The algorithm uses of an elliptical model to approximate the shape of the bond so that any aberrations from the specified dimensions can be easily identified. Missing bonds and double bonds can also be detected
Keywords
computer vision; inspection; integrated circuit manufacture; lead bonding; IC wire bond inspection; aberrations; computer vision; computerised picture processing; elliptical model approximation; Approximation algorithms; Assembly; Bonding processes; Humans; Image edge detection; Inspection; Integrated circuit modeling; Pixel; Shape; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Robotics and Automation, 1988. Proceedings., 1988 IEEE International Conference on
Conference_Location
Philadelphia, PA
Print_ISBN
0-8186-0852-8
Type
conf
DOI
10.1109/ROBOT.1988.12336
Filename
12336
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