Title :
Application of the Geselowitz relationship to the murine conductance catheter
Author :
Larson, E.R. ; Pearce, John A.
Author_Institution :
Electr. Eng., Univ. of Texas at Austin, Austin, TX, USA
fDate :
Aug. 28 2012-Sept. 1 2012
Abstract :
Conductance catheters are known to have a nonuniform spatial sensitivity due to the distribution of the electric field. The Geselowitz relation is applied to the murine conductance catheter using a finite element model to determine catheter´s spatial sensitivity in uniform media. Further analysis of FEM numerical modeling results using the Geselowitz relation provides a true measure of parallel conductance in a simplified murine left ventricle for assessment of the admittance method and hypertonic saline techniques. The spatial sensitivity of blood conductance (Gb) is determined throughout the cardiac cycle. Gb is converted to volume using Wei´s equation to determine if the presence of myocardium alters the nonlinear relationship through changes to the electric field shape. Results show that the admittance method correctly calculates Gb in comparison to the Geselowitz relation, and that the relationship between Gb and volume is accurately fit using Wei´s equation.
Keywords :
bioelectric phenomena; biomedical measurement; cardiology; catheters; electric admittance measurement; electric field effects; finite element analysis; physiological models; FEM numerical modeling; Geselowitz relationship; Weis equation; admittance method; blood conductance; cardiac cycle; catheters spatial sensitivity; electric field distribution; electric field shape; finite element model; hypertonic saline techniques; murine conductance catheter; myocardium; nonuniform spatial sensitivity; parallel conductance; simplified murine left ventricle; spatial sensitivity; Admittance; Blood; Catheters; Current measurement; Electrodes; Muscles; Sensitivity; Animals; Catheters; Electric Impedance; Finite Element Analysis; Mice;
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4119-8
Electronic_ISBN :
1557-170X
DOI :
10.1109/EMBC.2012.6346657