• DocumentCode
    20953
  • Title

    In-Built N+ Pocket p-n-p-n Tunnel Field-Effect Transistor

  • Author

    Abdi, Dawit ; Kumar, M.J.

  • Author_Institution
    Dept. of Electr. Eng., Indian Inst. of Technol., New Delhi, New Delhi, India
  • Volume
    35
  • Issue
    12
  • fYear
    2014
  • fDate
    Dec. 2014
  • Firstpage
    1170
  • Lastpage
    1172
  • Abstract
    The source-pocket (p-n-p-n) tunnel field effect transistor (TFET) has a narrow and highly doped N+ pocket layer between the source and channel to enhance the overall performance of the conventional p-i-n TFET. However, realizing this, N+ pocket increases the fabrication complexity since either an epitaxial growth in vertical TFETs or an implantation in planar TFETs is required to create the N+ pocket. In this letter, using the charge plasma concept, we propose a technique to realize an in-built N+ pocket without the need for a separate implantation. We demonstrate using 2-D simulations that the proposed in-built N+ pocket p-n-p-n TFET exhibits a higher ION (~20 times) and a steeper subthreshold swing (25 mV/decade) as compared with the conventional p-i-n TFET. Our approach overcomes the difficulty of creating a narrow N+ pocket doping and thus makes the p-n-p-n TFET more attractive in carrying on with the scaling trend.
  • Keywords
    epitaxial growth; field effect transistors; semiconductor doping; tunnel transistors; 2D simulation; N pocket doping; charge plasma concept; conventional p-i-n TFET; epitaxial growth; fabrication complexity; implantation; in-built N pocket p-n-p-n tunnel field-effect transistor; planar TFET; pocket layer; source-pocket TFET; source-pocket tunnel field effect transistor; subthreshold swing; vertical TFET; Field effect transistors; Plasma applications; Semiconductor process modeling; Silicon; Tunneling; 2D TCAD simulation; 2D TCAD simulation.; Source-pocket (PNPN) TFET; pocket implantation; steep subthreshold slope; tunneling;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2014.2362926
  • Filename
    6942145