CTE-measurement and delamination growth by a real time Moire technique

In this study, a real time moire interferometry technique was presented. CTE (coefficient of thermal expansion) and glass transfer temperature (Tg) measurements of a molding compound were conducted with the aid of a recently developed vacuum thermal chamber and a computer imaging analysis system. This technique was also applied to the study of the thermo-mechanical deformation of a silicon/molding compound bimaterial with an interface delamination. The fringe patterns of the thermo-mechanical deformation were presented. The phase angle of the interface delamination were calculated and discussed