• DocumentCode
    2095982
  • Title

    The cover glass thermal and pressure deformation affect of optical performance in space image sensor

  • Author

    Hsu, M.Y. ; Lin, W.C. ; Chan, C.Y. ; Ho, C.F. ; Chang, S.T. ; Huang, T.M.

  • Author_Institution
    Instrum. Technol. Res. Center, Nat. Appl. Res. Labs., Hsinchu, Taiwan
  • fYear
    2011
  • fDate
    10-12 May 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The space image sensor cover glass was bounded in 1atm air pressure in manufacture process. The air pressure and thermal radiation would affect the sensor cover glass deformation in space orbit. Therefore, this study was discussing the air pressure and thermal deformation on different sensor cover glass thickness affect optical performance in telescope system. The air pressure and thermal deformation of cover glass was simulating by FEM (finite element analysis) software. The deformation sag was transform to optical wave front error, and calculates telescope system MTF (Modulation Transfer Function). The result shown the cover glass thickness wasn´t sensitive to sagittal direction MTF in different image high. Meanwhile, the cover glass thickness increase, the tangential direction MTF would decline with image high increase.
  • Keywords
    deformation; finite element analysis; glass; heat radiation; image sensors; optical transfer function; telescopes; FEM software; air pressure; deformation sag; finite element analysis software; manufacture process; optical performance; optical wavefront error; pressure 1 atm; pressure deformation; space image sensor cover glass; space orbit; tangential direction MTF; telescope system; telescope system MTF; telescope system modulation transfer function; thermal deformation; thermal radiation; Adaptive optics; Finite element methods; Glass; Image sensors; Optical imaging; Optical sensors; Thermal sensors; FEM; MTF; Space Image Sensor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Instrumentation and Measurement Technology Conference (I2MTC), 2011 IEEE
  • Conference_Location
    Binjiang
  • ISSN
    1091-5281
  • Print_ISBN
    978-1-4244-7933-7
  • Type

    conf

  • DOI
    10.1109/IMTC.2011.5944097
  • Filename
    5944097