DocumentCode
2096057
Title
Atomistic modeling of B activation and deactivation for ultra-shallow junction formation
Author
Aboy, Maria ; Pelaz, Lourdes ; Marqués, Luis A. ; Barbolla, Juan ; Mokhberi, Ali ; Takamura, Yayoi ; Griffin, Peter B. ; Plummer, James D.
Author_Institution
Valladolid Univ., Spain
fYear
2003
fDate
3-5 Sept. 2003
Firstpage
151
Lastpage
154
Abstract
We have investigated the physical mechanisms for the B clustering formation and dissolution for ultra-shallow junction formation. We have analyzed high-dose low-energy B implants and theoretical structures with box-shaped B profiles that are fully active. These structures could be simplifications of the situation resulting from regrowth of preamorphized or laser annealed B implants. For these conditions, we have to take into account new effects due to the high B concentration and the proximity to the surface. The simulations show that the deactivation mechanism for B implants in crystalline Si takes place through a high interstitial content path, and it happens even for low B doses. The deactivation of the B box depends on the B concentration. In the absence of excess Si interstitials, B deactivation only happens for very high B concentrations. This process is very slow for low temperature anneals. If there is a residual concentration of Si interstitials along with the B box, the deactivation will take place rapidly even at low temperatures. In the model, the reactivation mechanism takes place in all cases through the low interstitial content path, by the capture of native Si interstitial defects and the emission of B interstitials.
Keywords
annealing; boron; elemental semiconductors; interstitials; ion implantation; semiconductor doping; silicon; B activation; Si:B; atomistic modeling; box-shaped B profiles; deactivation; deactivation mechanism; high B concentration; high interstitial content path; high-dose low-energy B implants; laser annealed B implants; preamorphized B implants; regrowth; ultra-shallow junction formation; Amorphous materials; Annealing; Atomic layer deposition; Boron; Crystallization; Implants; Kinetic theory; Semiconductor process modeling; Silicon; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003. International Conference on
Conference_Location
Boston, MA, USA
Print_ISBN
0-7803-7826-1
Type
conf
DOI
10.1109/SISPAD.2003.1233659
Filename
1233659
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