DocumentCode
2096727
Title
Mobility modeling in presence of quantum effects
Author
Dragosits, K. ; Palankovski, V. ; Selberherr, S.
Author_Institution
Inst. fur Microelectron., Technische Univ. Wien, Austria
fYear
2003
fDate
3-5 Sept. 2003
Firstpage
271
Lastpage
274
Abstract
CMOS oxide thicknesses in the nanometer range lead to the development of TCAD models which take care of the quantum mechanical effects at the semiconductor/insulator interface. It is obvious that the quantum distribution of carriers will not fit to existing mobility models which were empirically developed employing a classical profile. Especially the terms which account for surface scattering need modifications. By utilizing an optimization framework and comparison with measurements stemming from overall 30 devices from two different technology nodes, this subject was rigorously investigated. Finally, a model was developed, where only one material parameter (instead of three) is needed to describe the semiconductor/oxide interface.
Keywords
CMOS integrated circuits; carrier density; carrier mobility; integrated circuit modelling; optimisation; quantum interference phenomena; semiconductor-insulator boundaries; surface scattering; technology CAD (electronics); CMOS oxide thicknesses; TCAD models; mobility modeling; optimization framework; quantum distribution; quantum effects; quantum mechanical effects; semiconductor/insulator interface; semiconductor/oxide interface; surface scattering; CMOS technology; Insulation; Lead compounds; Microelectronics; Particle scattering; Photonic band gap; Potential well; Quantum mechanics; Semiconductor device modeling; Surface fitting;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003. International Conference on
Conference_Location
Boston, MA, USA
Print_ISBN
0-7803-7826-1
Type
conf
DOI
10.1109/SISPAD.2003.1233689
Filename
1233689
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