DocumentCode :
2099229
Title :
Flexible multi-electrode array with integrated bendable CMOS-chip for implantable systems
Author :
Winkin, N. ; Mokwa, W.
Author_Institution :
Inst. of Mater. in Electr. Eng. 1, RWTH Aachen Univ., Aachen, Germany
fYear :
2012
fDate :
Aug. 28 2012-Sept. 1 2012
Firstpage :
3882
Lastpage :
3885
Abstract :
Micro-electrodes and micro-electrode arrays (MEAs) for stimulating neurons or recording action potentials are widely used in medical applications or biological research. For medical implants in many applications like brain implants or retinal implants there is a need for flexible MEAs with a large area and a large number of stimulation electrodes. In this work a flexible MEA with an embedded flexible silicon dummy CMOS-chip facing these challenges has been designed, manufactured and characterized. This approach offers the possibility by connecting and addressing several of these MEAs via a bus system, to increase the number and the density of electrodes significantly. This paper describes the design and fabrication process. Results on the mechanical and electrical behavior will be given and possible improvements for medical applications by this novel approach will be discussed.
Keywords :
CMOS integrated circuits; bioMEMS; biomedical electrodes; lab-on-a-chip; microelectrodes; prosthetics; brain implants; bus system; electrical behavior; electrode density; electrode number; embedded flexible silicon dummy CMOS-chip; flexible multielectrode arrays; implantable systems; integrated bendable CMOS-chip; mechanical behavior; medical implants; microelectrode arrays; recording action potentials; retinal implants; stimulating neurons; Arrays; Conductors; Electrodes; Gold; Implants; Polyimides; Retina; Electric Impedance; Electrodes, Implanted; Gold; Imides; Microelectrodes; Oxides; Pliability; Semiconductors; Surface Properties;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE
Conference_Location :
San Diego, CA
ISSN :
1557-170X
Print_ISBN :
978-1-4244-4119-8
Electronic_ISBN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2012.6346815
Filename :
6346815
Link To Document :
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