• DocumentCode
    2099229
  • Title

    Flexible multi-electrode array with integrated bendable CMOS-chip for implantable systems

  • Author

    Winkin, N. ; Mokwa, W.

  • Author_Institution
    Inst. of Mater. in Electr. Eng. 1, RWTH Aachen Univ., Aachen, Germany
  • fYear
    2012
  • fDate
    Aug. 28 2012-Sept. 1 2012
  • Firstpage
    3882
  • Lastpage
    3885
  • Abstract
    Micro-electrodes and micro-electrode arrays (MEAs) for stimulating neurons or recording action potentials are widely used in medical applications or biological research. For medical implants in many applications like brain implants or retinal implants there is a need for flexible MEAs with a large area and a large number of stimulation electrodes. In this work a flexible MEA with an embedded flexible silicon dummy CMOS-chip facing these challenges has been designed, manufactured and characterized. This approach offers the possibility by connecting and addressing several of these MEAs via a bus system, to increase the number and the density of electrodes significantly. This paper describes the design and fabrication process. Results on the mechanical and electrical behavior will be given and possible improvements for medical applications by this novel approach will be discussed.
  • Keywords
    CMOS integrated circuits; bioMEMS; biomedical electrodes; lab-on-a-chip; microelectrodes; prosthetics; brain implants; bus system; electrical behavior; electrode density; electrode number; embedded flexible silicon dummy CMOS-chip; flexible multielectrode arrays; implantable systems; integrated bendable CMOS-chip; mechanical behavior; medical implants; microelectrode arrays; recording action potentials; retinal implants; stimulating neurons; Arrays; Conductors; Electrodes; Gold; Implants; Polyimides; Retina; Electric Impedance; Electrodes, Implanted; Gold; Imides; Microelectrodes; Oxides; Pliability; Semiconductors; Surface Properties;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE
  • Conference_Location
    San Diego, CA
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-4119-8
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2012.6346815
  • Filename
    6346815