DocumentCode
2099229
Title
Flexible multi-electrode array with integrated bendable CMOS-chip for implantable systems
Author
Winkin, N. ; Mokwa, W.
Author_Institution
Inst. of Mater. in Electr. Eng. 1, RWTH Aachen Univ., Aachen, Germany
fYear
2012
fDate
Aug. 28 2012-Sept. 1 2012
Firstpage
3882
Lastpage
3885
Abstract
Micro-electrodes and micro-electrode arrays (MEAs) for stimulating neurons or recording action potentials are widely used in medical applications or biological research. For medical implants in many applications like brain implants or retinal implants there is a need for flexible MEAs with a large area and a large number of stimulation electrodes. In this work a flexible MEA with an embedded flexible silicon dummy CMOS-chip facing these challenges has been designed, manufactured and characterized. This approach offers the possibility by connecting and addressing several of these MEAs via a bus system, to increase the number and the density of electrodes significantly. This paper describes the design and fabrication process. Results on the mechanical and electrical behavior will be given and possible improvements for medical applications by this novel approach will be discussed.
Keywords
CMOS integrated circuits; bioMEMS; biomedical electrodes; lab-on-a-chip; microelectrodes; prosthetics; brain implants; bus system; electrical behavior; electrode density; electrode number; embedded flexible silicon dummy CMOS-chip; flexible multielectrode arrays; implantable systems; integrated bendable CMOS-chip; mechanical behavior; medical implants; microelectrode arrays; recording action potentials; retinal implants; stimulating neurons; Arrays; Conductors; Electrodes; Gold; Implants; Polyimides; Retina; Electric Impedance; Electrodes, Implanted; Gold; Imides; Microelectrodes; Oxides; Pliability; Semiconductors; Surface Properties;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2012 Annual International Conference of the IEEE
Conference_Location
San Diego, CA
ISSN
1557-170X
Print_ISBN
978-1-4244-4119-8
Electronic_ISBN
1557-170X
Type
conf
DOI
10.1109/EMBC.2012.6346815
Filename
6346815
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