DocumentCode
2100499
Title
Phased arrays using dual-wafer fabrication/high-integration processes
Author
Rock, Janice C.
Author_Institution
Res. Dev. & Eng. Center, US Army Aviation Missile, Redstone Arsenal, AL, USA
Volume
2
fYear
2004
fDate
6-13 March 2004
Firstpage
914
Abstract
This paper explores the current research being conducted at the US Army Aviation and Missile Research, Development and Engineering Center (RDEC) on the Redstone Arsenal in Huntsville, Alabama. It discusses the benefits of an electronically steerable phased array (ESA), in particular as it applies to a military environment. It includes a background study into the components behind the active ESA and discusses the current level of integration of the microelectronic circuitry in the design. The purpose of the research is to explore the highest possible level of component integration for a phased array utilizing the state-of-the-art in solid state electronics and semiconductor fabrication and packaging. The paper also discusses the future direction of the research to be conducted on the RDEC.
Keywords
MMIC; antenna phased arrays; antenna radiation patterns; beam steering; integrated circuit packaging; military radar; phased array radar; synthetic aperture radar; wafer bonding; dual wafer fabrication; electronically steerable phased arrays; high integration processes; microelectronic circuitry design; military environment; semiconductor fabrication; semiconductor packaging; solid state electronics; state of the art; Beam steering; Costs; Fabrication; Microelectronics; Missiles; Phased arrays; Radar tracking; Sensor arrays; Solid state circuits; Target tracking;
fLanguage
English
Publisher
ieee
Conference_Titel
Aerospace Conference, 2004. Proceedings. 2004 IEEE
ISSN
1095-323X
Print_ISBN
0-7803-8155-6
Type
conf
DOI
10.1109/AERO.2004.1367691
Filename
1367691
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