DocumentCode :
2100499
Title :
Phased arrays using dual-wafer fabrication/high-integration processes
Author :
Rock, Janice C.
Author_Institution :
Res. Dev. & Eng. Center, US Army Aviation Missile, Redstone Arsenal, AL, USA
Volume :
2
fYear :
2004
fDate :
6-13 March 2004
Firstpage :
914
Abstract :
This paper explores the current research being conducted at the US Army Aviation and Missile Research, Development and Engineering Center (RDEC) on the Redstone Arsenal in Huntsville, Alabama. It discusses the benefits of an electronically steerable phased array (ESA), in particular as it applies to a military environment. It includes a background study into the components behind the active ESA and discusses the current level of integration of the microelectronic circuitry in the design. The purpose of the research is to explore the highest possible level of component integration for a phased array utilizing the state-of-the-art in solid state electronics and semiconductor fabrication and packaging. The paper also discusses the future direction of the research to be conducted on the RDEC.
Keywords :
MMIC; antenna phased arrays; antenna radiation patterns; beam steering; integrated circuit packaging; military radar; phased array radar; synthetic aperture radar; wafer bonding; dual wafer fabrication; electronically steerable phased arrays; high integration processes; microelectronic circuitry design; military environment; semiconductor fabrication; semiconductor packaging; solid state electronics; state of the art; Beam steering; Costs; Fabrication; Microelectronics; Missiles; Phased arrays; Radar tracking; Sensor arrays; Solid state circuits; Target tracking;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Aerospace Conference, 2004. Proceedings. 2004 IEEE
ISSN :
1095-323X
Print_ISBN :
0-7803-8155-6
Type :
conf
DOI :
10.1109/AERO.2004.1367691
Filename :
1367691
Link To Document :
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