• DocumentCode
    2100499
  • Title

    Phased arrays using dual-wafer fabrication/high-integration processes

  • Author

    Rock, Janice C.

  • Author_Institution
    Res. Dev. & Eng. Center, US Army Aviation Missile, Redstone Arsenal, AL, USA
  • Volume
    2
  • fYear
    2004
  • fDate
    6-13 March 2004
  • Firstpage
    914
  • Abstract
    This paper explores the current research being conducted at the US Army Aviation and Missile Research, Development and Engineering Center (RDEC) on the Redstone Arsenal in Huntsville, Alabama. It discusses the benefits of an electronically steerable phased array (ESA), in particular as it applies to a military environment. It includes a background study into the components behind the active ESA and discusses the current level of integration of the microelectronic circuitry in the design. The purpose of the research is to explore the highest possible level of component integration for a phased array utilizing the state-of-the-art in solid state electronics and semiconductor fabrication and packaging. The paper also discusses the future direction of the research to be conducted on the RDEC.
  • Keywords
    MMIC; antenna phased arrays; antenna radiation patterns; beam steering; integrated circuit packaging; military radar; phased array radar; synthetic aperture radar; wafer bonding; dual wafer fabrication; electronically steerable phased arrays; high integration processes; microelectronic circuitry design; military environment; semiconductor fabrication; semiconductor packaging; solid state electronics; state of the art; Beam steering; Costs; Fabrication; Microelectronics; Missiles; Phased arrays; Radar tracking; Sensor arrays; Solid state circuits; Target tracking;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace Conference, 2004. Proceedings. 2004 IEEE
  • ISSN
    1095-323X
  • Print_ISBN
    0-7803-8155-6
  • Type

    conf

  • DOI
    10.1109/AERO.2004.1367691
  • Filename
    1367691