Title :
3D packaging solutions for a silicon micropump
Author :
Kelly, G. ; Alderman, J. ; Lyden, C. ; Barrett, J. ; Morrissey, A. ; Val, A. ; Sbiaa, Z. ; Camon, H.
Author_Institution :
Nat. Microelectron. Res. Centre, Univ. Coll. Cork, Ireland
Abstract :
A novel microsystem incorporating a micromachined silicon membrane pump, packaged in a 3D MCM-V package is described. Finite element techniques are used to analyse the encapsulation stress in the assembled structure and the silicon membrane. The design of the silicon chip carrier substrates is improved by modifying the design of the cutting windows to reduce the risk of cracking. A combination of numerical and analytical techniques are used to deduce limits for the maximum permissible dimensions of the membrane to minimise the risk of buckling due to residual compressive stresses
Keywords :
buckling; encapsulation; finite element analysis; internal stresses; membranes; micromachining; micropumps; multichip modules; plastic deformation; silicon; 3D MCM-V package; 3D packaging; Si; Si micropump; chip carrier substrate design; encapsulation stress; finite element techniques; micromachined membrane pump; residual compressive stresses; Assembly; Biomembranes; Chemical analysis; Chemical sensors; Compressive stress; Encapsulation; Finite element methods; Integrated circuit packaging; Micropumps; Silicon;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606332
