• DocumentCode
    2101320
  • Title

    Development of 6-DOF haptic interface for tele-micromanipulation systems

  • Author

    Ando, Noriaki ; Morioka, Kazuyuki ; Szemes, Peter T. ; Hashimoto, Hideki

  • Author_Institution
    Inst. of Ind. Sci., Univ. of Tokyo, Japan
  • Volume
    1
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    444
  • Abstract
    Discusses a control scheme for a 6-DOF haptic interface for tele-micromanipulation systems. We have developed micro-teleoperation systems for micro tasks, such as assembly or manufacturing. We introduce a haptic interface that gives operators a sense of presence, as if he/she is touching an expanded version of the micro-object with his/her fingers. First, the system structure of the master manipulator and its system configuration are shown. To improve the free-motion performance and response-force isotropy of the master haptic device, a model-reference adaptive controller (MRAC) is introduced. Some experiments are conducted and their results are evaluated. Furthermore, we connected the master systems and a slave system through a network and evaluated the teleoperation property. Finally, we conclude with a discussion about our experimental results and a statement about our future work
  • Keywords
    haptic interfaces; microassembling; micromanipulators; model reference adaptive control systems; telerobotics; 6-DOF haptic interface control scheme; expanded micro-objects; free-motion performance; master manipulator system structure; micro tasks; micro-assembly; micro-manufacturing; micro-teleoperation systems; model-reference adaptive controller; network; operator presence; response-force isotropy; slave systems; system configuration; tele-micromanipulation systems; touch; Adaptive control; Collaboration; Collaborative work; Contacts; Control systems; Electrical equipment industry; Haptic interfaces; Humans; Manufacturing; Microscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics Society, 2001. IECON '01. The 27th Annual Conference of the IEEE
  • Conference_Location
    Denver, CO
  • Print_ISBN
    0-7803-7108-9
  • Type

    conf

  • DOI
    10.1109/IECON.2001.976523
  • Filename
    976523