DocumentCode
2101642
Title
A Message-Passing Hardware/Software Co-simulation Environment to Aid in Reconfigurable Computing Design Using TMD-MPI
Author
Saldaña, Manuel ; Ramalho, Emanuel ; Chow, Paul
Author_Institution
Arches Comput. Syst., Toronto, ON
fYear
2008
fDate
3-5 Dec. 2008
Firstpage
265
Lastpage
270
Abstract
High-performance reconfigurable computers (HPRC) provide a mix of standard processors and FPGAs to collectively accelerate applications. This introduces new design challenges, such as the need for portable programming models across HPRCs, and system-level verification tools. In this paper, we extend previous work on TMD-MPI to include an MPI-based approach to exchange data between X86 processors and hardware engines inside FPGAs that improves design portability by hiding vendor-specific communication details. Also, we have created a tool called the message-passing simulation framework (MSF) that we use to develop TMD-MPI itself as well as an application development tool that enables an FPGA in simulation to exchange messages with other X86 processors. As an example, we simulate a LINPACK benchmark hardware core using an Intel-FSB-FPGA platform to quickly prototype the hardware, to test the communications and to verify the benchmark results.
Keywords
field programmable gate arrays; message passing; reconfigurable architectures; FPGA; TMD-MPI; data exchange; field programmable gate arrays; high-performance reconfigurable computers; message-passing hardware/software cosimulation environment; reconfigurable computing design; system-level verification tools; Application software; Benchmark testing; Computational modeling; Engines; Field programmable gate arrays; Hardware; Software debugging; Software testing; System testing; Virtual prototyping; FPGA; High-Performance; MPI; Message-Passing; Parallel Programming; Reconfigurable; Simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Reconfigurable Computing and FPGAs, 2008. ReConFig '08. International Conference on
Conference_Location
Cancun
Print_ISBN
978-1-4244-3748-1
Electronic_ISBN
978-0-7695-3474-9
Type
conf
DOI
10.1109/ReConFig.2008.10
Filename
4731805
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