Title :
A design of touch detection algorithm for bonding tip of wire bonder machine
Author :
Kim, Jung-Han ; Oh, Jun-Ho
Author_Institution :
Precision Instrum. R&D Center, Samsung Techwin, Sungnam, South Korea
Abstract :
This paper describes a design of touch detection algorithm of bonding tip in gold wire bonding process. It contains a new design of a detection algorithm for capillary contact on pad and lead in the wire bonding process of interconnection between pads and leads. The design method is developed by a systematic approach from the viewpoint of handling the risk of false detection based on not trial and error but on statistical analysis. The paper shows a systematic approach to the design of a velocity estimator and touch detection algorithm for a bonding tip by introducing the concept of the optimal estimator. The statistical approach provides more convenient and powerful tools for managing the risk of false contact detection or velocity estimate, which leads to more stable detection time and finally more stable bonding quality. Real wire bonding experimental results are presented to demonstrate the advantages of the proposed algorithm
Keywords :
integrated circuit interconnections; joining processes; semiconductor device packaging; statistical analysis; wires (electric); bonding tip; capillary contact; false detection risk handling; gold wire bonding process; low cost packaging technology; semiconductor package; stable bonding quality; stable detection time; statistical analysis; touch detection algorithm; velocity estimator design; Algorithm design and analysis; Bonding processes; Design methodology; Detection algorithms; Energy management; Gold; Quality management; Risk management; Statistical analysis; Wire;
Conference_Titel :
Industrial Electronics Society, 2001. IECON '01. The 27th Annual Conference of the IEEE
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-7108-9
DOI :
10.1109/IECON.2001.976557
