Title :
Dynamic behavior and application of micro sensors with negative temperature coefficient
Author :
Huang, Jin-Biao ; Ho, Chih-Ming ; Jiang, Fukang ; Tai, Yu-Chong
Author_Institution :
Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
Abstract :
In our experiments a differential (high pass) frequency response of a thermal sensor was observed. The theoretical analyses have been developed to characterize the new phenomena of the micro thermal sensor. The thermal sensor is made of low level doped poly-silicon with a negative TCR (temperature coefficient of resistivity) of about -0.2%/°C. It has dimensions of 2×80×0.5 μm3 and it is operated under constant current. This high pass characteristic has been applied to the frequency compensation of conventional thermal sensors with positive TCR. On the same silicon chip, one sensor is doped to a high level so that it has a positive TCR while the other has negative TCR by being doped to a low level. The integration (low pass) characteristic in the former sensor can be compensated for by the differential (high pass) characteristic in the latter sensor. A cut-off frequency of about 100 kHz for the former sensor has been reached by using this compensation (called self-compensation)
Keywords :
compensation; electric sensing devices; frequency response; micromachining; microsensors; semiconductor device models; silicon; temperature sensors; 0.5 micron; 100 kHz; 2 micron; 80 micron; Laplace transform; cut-off frequency; differential frequency response; doped polysilicon; dynamic behavior; frequency compensation; high pass frequency response; micromachined sensor; microsensors; models; negative temperature coefficient; self-compensation; thermal sensor; Circuits; Conductivity; Frequency response; Sensor phenomena and characterization; Sensor systems and applications; Silicon; Temperature dependence; Temperature sensors; Thermal resistance; Thermal sensors;
Conference_Titel :
Instrumentation and Measurement Technology Conference, 1996. IMTC-96. Conference Proceedings. Quality Measurements: The Indispensable Bridge between Theory and Reality., IEEE
Conference_Location :
Brussels
Print_ISBN :
0-7803-3312-8
DOI :
10.1109/IMTC.1996.507560