Title :
AODV protocol with scheduling priority flow in MAC layer (AODV-SPF)
Author :
Chou, So-Tsung ; Chern, Hann-Tzong ; Shiao, Cheng-Mu
Author_Institution :
Dept. of Inf. Manage., Kang-Ning Junior Coll. of Med. Care & Manage., Taipei, Taiwan
Abstract :
As mobile computing technology gains great attention and popularity in recent year, the need for ad hoc routing protocols continue to grow. There have been many researches proposing different models of routing protocols and numerous simulations to enhance their performances under varying conditions and constraints. However, most of them only focus on network layer without considering the influence of MAC layer. In this paper, we investigate the effect of MAC layer by simulating the performances of ad hoc on-demand distance vector routing protocol (AODV) which runs over different MAC mechanisms, e.g., basic access or RTS/CTS, with different data traffic load. A new strategy of cross layer algorithm, i.e., AODV-SPF, is proposed based on the characteristics of reactive routing and multi-hop jumping. We try to transmit a parameter of total hop count, which is used to recalculate the contention window of the nodes along the routing path, over MAC layer. This framework could avoid data collision in MAC layer, and results in getting better performances of data transmission in network layer. Extensive simulations show that the proposed scheme is able to earn significant improvement over traditional algorithm.
Keywords :
ad hoc networks; routing protocols; scheduling; telecommunication traffic; AODV protocol; AODV-SPF; MAC layer; MAC mechanisms; ad hoc on-demand distance vector routing protocol; ad hoc routing protocols; contention window; cross layer algorithm; data collision; data traffic load; data transmission; mobile computing technology; multihop jumping; network layer; reactive routing; scheduling priority flow; total hop count; Silicon carbide;
Conference_Titel :
Networked Computing and Advanced Information Management (NCM), 2010 Sixth International Conference on
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-7671-8
Electronic_ISBN :
978-89-88678-26-8