• DocumentCode
    2102759
  • Title

    International student mobility in engineering education

  • Author

    Heckel, U. ; Bach, U. ; Richert, A. ; Jeschke, Sabina ; Petermann, Marcus

  • Author_Institution
    IMA/ZLW & IfU, RWTH Aachen Univ., Aachen, Germany
  • fYear
    2012
  • fDate
    17-20 April 2012
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Engineering students are, compared to their counterparts in other disciplines, less mobile resulting in limited intercultural skills. Globalization requires professionals being excellent in their fields and being able to work on a global scale at the same time. So far, engineering education has put too little stress on integrating intercultural competences into curricula. This paper shows new approaches to incorporate international experiences into higher engineering education. First, it analyzes the current situation of international student mobility in Germany, before emphasizing the general motivation for international student exchange especially in engineering science. A consortium of three excellent German engineering universities was put up to introduce new measures for increasing student mobility as is described subsequently. This paper represents work in progress. Thus, further results will be published continuously.
  • Keywords
    cultural aspects; engineering education; further education; globalisation; Germany; engineering university; globalization; higher engineering education; intercultural competency; intercultural skill; international experience; international student mobility; Cultural differences; Educational institutions; Engineering students; Industries; Mobile communication; International student mobility; curricula development; engineering education; inbound; intercultural competences; outbound;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Global Engineering Education Conference (EDUCON), 2012 IEEE
  • Conference_Location
    Marrakech
  • ISSN
    2165-9559
  • Print_ISBN
    978-1-4673-1457-2
  • Electronic_ISBN
    2165-9559
  • Type

    conf

  • DOI
    10.1109/EDUCON.2012.6201070
  • Filename
    6201070