• DocumentCode
    2102767
  • Title

    Thin-film lithium niobate on diamond-coated silicon substrates for surface acoustic wave applications

  • Author

    Jiun-Ting Lee ; Little, N. ; Rabson, T. ; Robert, M.

  • Author_Institution
    Dept. of Chem. Eng., Rice Univ., Houston, TX, USA
  • Volume
    1
  • fYear
    1999
  • fDate
    17-20 Oct. 1999
  • Firstpage
    269
  • Abstract
    The goal of this project is to produce GHz-range electronic filters with low insertion loss for front-end radio-frequency surface acoustic wave (SAW) devices. Theory predicts that lithium niobate thin films on diamond/silicon substrates have high electromechanical coupling coefficients and SAW propagation velocities because of the interaction with the high-acoustic-velocity diamond layer. RF-magnetron sputtering technology is used to grow lithium niobate films on diamond coated silicon substrates, thus allowing the SAW filters to be integrated with electronic circuits, thereby achieving size reduction with increased bandwidth. The structural properties and morphology of the films are investigated by X-ray diffraction and atomic force microscopy. Interdigital transducers (IDT) are deposited onto the LiNbO3/diamond/silicon films and the SAW properties are being studied.
  • Keywords
    X-ray diffraction; atomic force microscopy; interdigital transducers; lithium compounds; piezoelectric thin films; sputter deposition; surface acoustic wave filters; surface acoustic wave transducers; GHz-range electronic filters; LiNbO3; RF-magnetron sputtering; SAW filters; SAW propagation velocity; Si; X-ray diffraction; atomic force microscopy; bandwidth; diamond-coated silicon substrates; electromechanical coupling coefficient; front-end RF surface acoustic wave devices; insertion loss; interdigital transducers; morphology; size reduction; thin-films; Atomic force microscopy; Filters; Insertion loss; Lithium niobate; Semiconductor films; Semiconductor thin films; Silicon; Sputtering; Substrates; Surface acoustic waves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1999. Proceedings. 1999 IEEE
  • Conference_Location
    Caesars Tahoe, NV
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-5722-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1999.849400
  • Filename
    849400