• DocumentCode
    2102898
  • Title

    Application and testing of high temperature materials for solenoid coils

  • Author

    Sanchez, Robert O. ; Archer, Wendel E. ; Zich, John L.

  • Author_Institution
    Sandia Nat. Labs., Albuquerque, NM, USA
  • fYear
    1997
  • fDate
    22-25 Sep 1997
  • Firstpage
    325
  • Lastpage
    332
  • Abstract
    Sandia National Laboratories has designed and proven-in two new solenoid coils for a highly-reliable electromechanical switch. Mil-Spec Magnetics Inc., Walnut, CA, manufactured the coils. The new design utilizes two new materials: Liquid Crystal Polymer (Vectra C130) for the bobbin and Thermal Barrier Silicone (VI-SIL, V-658) for the encapsulant. The use of these two new materials solved most of the manufacturing problems inherent in the old Sandia design. The coils are easier to precision wind and more robust for handling, testing, and storage. The coils have some unique weapon related safety requirements. The most severe of these requirements is the 400°C, 1600 V test. The coils must not, and did not, produce any outgassing products to affect the voltage breakdown between contacts in the switch at these temperatures and voltages. Actual coils in switches were tested under these conditions. This paper covers the prove-in of this new coil design
  • Keywords
    electric breakdown; encapsulation; insulation testing; liquid crystal polymers; silicone insulation; solenoids; switches; weapons; 1600 V; 400 C; Liquid Crystal Polymer; Mil-Spec Magnetics; Thermal Barrier Silicone; V-658; VI-SIL; Vectra C130; bobbin; contacts; electromechanical switch; encapsulant; handling; high temperature materials; manufacturing problems; robust coils; solenoid coils; storage; testing; voltage breakdown; weapon related safety requirements; weapons arming;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference, 1997, and Electrical Manufacturing & Coil Winding Conference. Proceedings
  • Conference_Location
    Rosemont, IL
  • ISSN
    0362-2479
  • Print_ISBN
    0-7803-3959-2
  • Type

    conf

  • DOI
    10.1109/EEIC.1997.651126
  • Filename
    651126