Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations

Presents some results in order to derive reliability behaviour of BGA (ball grid array) assemblies when they are submitted to thermal cycles mission profile, as it is now common in a lot of industrial applications. In the field of surface mounted technology (SMT), reliability testing has become longer and very expensive. This is due to the large variety of technological features that can be encountered even on the same board where different package sizes and types can coexist. It is important in this case to identify the most critical attribute and to try to simplify the reliability test procedure through the definition of a "generic" accelerated test, performed on only one assembly and extensible to package configurations on condition that the assembling technology has not changed.