Title :
FEA contact element technique and its applications in metal lead forming failure analysis
Author_Institution :
Adv. Micro Devices (Singapore), Singapore, Singapore
Abstract :
FEA contact element technique has been established and was successfully applied to metal lead forming simulation. One of the commonly encountered lead finish defects, the lead shift problem, was studied in more detail. The results clearly show that the lead shift is due to the unsymmetrical profile of the lead frame used. The FEA results are in good accordance with the experimental measurement.
Keywords :
digital simulation; failure analysis; finite element analysis; integrated circuit packaging; integrated circuit reliability; FEA contact element technique; IC packaging; failure analysis; lead forming simulation; lead shift problem; metal lead forming; unsymmetrical profile; Annealing; Copper; Differential equations; Failure analysis; Finite element methods; Integrated circuit packaging; Lead; Mathematics; Metals industry; Toxicology;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2002. IPFA 2002. Proceedings of the 9th International Symposium on the
Print_ISBN :
0-7803-7416-9
DOI :
10.1109/IPFA.2002.1025610
