DocumentCode
2103032
Title
FEA contact element technique and its applications in metal lead forming failure analysis
Author
Fai, Lam Tim
Author_Institution
Adv. Micro Devices (Singapore), Singapore, Singapore
fYear
2002
fDate
2002
Firstpage
47
Lastpage
50
Abstract
FEA contact element technique has been established and was successfully applied to metal lead forming simulation. One of the commonly encountered lead finish defects, the lead shift problem, was studied in more detail. The results clearly show that the lead shift is due to the unsymmetrical profile of the lead frame used. The FEA results are in good accordance with the experimental measurement.
Keywords
digital simulation; failure analysis; finite element analysis; integrated circuit packaging; integrated circuit reliability; FEA contact element technique; IC packaging; failure analysis; lead forming simulation; lead shift problem; metal lead forming; unsymmetrical profile; Annealing; Copper; Differential equations; Failure analysis; Finite element methods; Integrated circuit packaging; Lead; Mathematics; Metals industry; Toxicology;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2002. IPFA 2002. Proceedings of the 9th International Symposium on the
Print_ISBN
0-7803-7416-9
Type
conf
DOI
10.1109/IPFA.2002.1025610
Filename
1025610
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