Title :
Terabus: A 160-Gb/s Bidirectional Board-Level Optical Data Bus
Author :
Doany, F.E. ; Schow, C.L. ; Kash, J.A. ; Baks, C. ; Budd, R. ; Pepeljugoski, P. ; Kuchta, D. ; Dangel, R. ; Horst, F. ; Offrein, B.
Author_Institution :
IBM T. J. Watson Research Center, Yorktown Heights, NY 10598. Tel.: (914)945 2831. Email: doany@us.ibm.com
Abstract :
A chip-to-chip optical interconnect on a printed circuit board achieves a 160-Gb/s aggregate bidirectional data rate through 32 parallel polymer waveguides at 13.5 mW/Gb/s. This is the fastest, widest, and most integrated optical bus ever demonstrated.
Keywords :
High speed optical techniques; Optical arrays; Optical interconnections; Optical receivers; Optical transmitters; Optical waveguides; Packaging; Printed circuits; Transceivers; Vertical cavity surface emitting lasers;
Conference_Titel :
Lasers and Electro-Optics Society, 2007. LEOS 2007. The 20th Annual Meeting of the IEEE
Conference_Location :
Lake Buena Vista, FL, USA
Print_ISBN :
978-1-4244-0925-9
Electronic_ISBN :
1092-8081
DOI :
10.1109/LEOS.2007.4382521
