Generic integrated circuit for signal conditioning

This paper presents a complete analog signal conditioning chip, called BONFIM IC, fabricated in 0.5 μm AMIS CMOS process. The conditioning circuit architecture here presented is composed by one differential amplifier and one buffer circuit. The differential amplifier, major part of total circuit, is responsible by amplifying the input signal as well to provide a DC level for it. Thus, adjusting it for excursion in range between 0 V and a reference voltage value defined. The input signal being measured comes from external environment, like a data acquisition system. The buffer circuit makes a copy of the output voltage from the differential amplifier at its own low impedance output, providing analog signal for an analog to digital converter. The chip can be used in measurement of large and small analog signals or in data acquisition systems.